¡¡ChinaBestProducts Laser scarifying system
HGL-SRY50C silicon scarifying system
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| During the manufacturing of
integrated circuit, thousands of them are produced on a big base sheet,
then they are divided into single piece to be packed. The traditional method is cut by diamond raw, but there are always cracks because of the raw' force, so the circuit is destroyed. That decrease the product quality and efficiency. |
laser cutting machine focus laser beam on silicon sheet and make high power intensity, a slot formed and laser energy focused on it, the silicon sheet was cut off along the slot. Or the silicon can be cut by laser directly into required form. For the laser spot is very small and adopt no-touch processing, the heat affected zone is very small, so by using this technology the productivity and efficiency can be increased. HGL-SRY50 series laser cutting machine is widely used in silicon materials. the system use Nd:YAG solid state laser and imported Q-switch. The two dimensional working table use step motor whose positioning accuracy is less than 0.02 mm and is suitable for long time inline use. compared with traditional machine cutting, laser cutting technology has the following advantages: 1¡¢high cutting speed, easy for online using, high efficiency 2¡¢no-touch processing, avoiding damage on silicon material surface 3¡¢when laser beam is focused, its power intensity is very high, so deep cutting is available 4¡¢ straight cutting line, uniform cutting depth 5¡¢low cost and high safety
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